Experimental protocols active. This track explores pre-production hardware and sovereign AI scaling roadmaps.
Roadmap & Beta Lab
The pace of AI infrastructure is accelerating. This lab section outlines our strategic vision for 2025 and beyond, from the integration of Blackwell GB200 architectures to advancements in liquid-cooled sovereign compute.
Level 100: Blackwell Integration
- • GB200 NVL72: Planning for 30x faster real-time LLM inference using the new Blackwell transformer engine.
- • Second-Gen Transformer Engine: Optimizing FP4/FP6 precision for extreme-scale sovereign models.
Lab Note: The transition from H100 to B200 represents the most significant leap in compute density in a decade.
View Silicon RoadmapLevel 200: Direct-to-Chip Liquid Cooling
- • DLC Implementation: Testing cold-plate technologies required to dissipate the 1200W+ TDP of next-gen GPUs.
- • CDU Orchestration: Integrating Coolant Distribution Units into the sovereign AI control plane.
Lab Note: Air cooling has reached its physical limit. Sovereign AI clusters will be liquid-cooled by 2026.
Analyze ThermalsLevel 300: Optical Compute Interconnects
- • CPO (Co-Packaged Optics): Exploring direct optical-to-chip connectivity to eliminate copper latency bottlenecks.
- • 800G/1.6T Fabrics: Testing pre-standard InfiniBand and Ethernet fabrics for massive cluster scale-out.
Lab Note: The future is photonics. We are modeling the transition from electrical to optical switching for trillion-parameter models.
Advanced Fabric ResearchValidation Tool: Blackwell TCO & ROI Modeler
Lab Analysis ActiveIs the upgrade to Blackwell economically viable for your sovereign cluster? Use this modeler to compare Tokens-per-Watt and Cluster Density metrics between [H100](http://googleusercontent.com/shopping_content/1_link) and GB200 architectures.
Thermal Infrastructure: 2025-2026 Standards
| Technology | Max TDP Support | PUE Efficiency | Lab Readiness |
|---|---|---|---|
| Traditional Air Cooling | Up to 20kW / Rack | 1.4 – 1.6 | Legacy / EOL for AI |
| Direct-to-Chip (DLC) | 80kW – 100kW+ / Rack | 1.1 – 1.2 | Production Beta |
| Immersion Cooling | 100kW+ / Rack | < 1.05 | Experimental R&D |
Level 300: The Photonic Interconnect Era
- Co-Packaged Optics (CPO): Integrating fiber-optic transceivers directly onto the GPU package to eliminate the energy-heavy conversion between electrical and optical signals.
- Optical Switching Fabrics: Researching MEMS-based optical circuit switches that allow for reconfigurable, sub-microsecond topologies in trillion-parameter model training.
- Next-Gen NVLink: Modeling the performance gains of moving from copper-based NVLink to optical-based interconnects for 1.6T and 3.2T bandwidth tiers.
Architect’s Verdict: As compute density doubles, copper interconnects become a thermal and latency liability. Photonic Fabrics are the only path to sustaining the next generation of sovereign AI clusters.
Access Lab Research Docs